SANTA CLARA, Calif. — New generations of higher density, smaller stacked multichip packages (MCP) are needed to meet the exploding memory needs of servers, switches and routers, and new high speed ...

Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. It’s a confusing landscape with a plethora of buzzwords ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

I wore the world's first HDR10 smart glasses TCL's new E Ink tablet beats the Remarkable and Kindle Anker's new charger is one of the most unique I've ever seen Best laptop cooling pads Best flip ...

Toshiba Corp. has developed a new chip production technology that increases by 50 percent the number of layers of components that can be crammed inside a standard Multi Chip Package (MCP) for use in ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in ...

Flip chip packaging connects chips directly to boards using solder bumps, skipping the old wire bonding method for a more ...

The United States Patent for Intel's multi-chip package and die-to-die interconnect has been published in full. Initially filed in January, 2018, the patent outlines a few weird and wonderful ways of ...