The conventional flip chip ball grid array (FCBGA) package platform has wide industry usage and provides high electrical performance. However, as high performance requirements increased, it encounters ...

As the quantity, complexity, and functions of electronic devices in automobiles increase, understanding and characterizing package reliability is of significant concern and importance. The Automotive ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Daeduck Electronics announced the successful development of a large body FCBGA substrate for AI servers and data centers. Established in 1965, Daeduck Electronics ...

Samsung Electro-Mechanics, the electronic parts manufacturing affiliate of Samsung Electronics, said Sunday it will ramp up the sales portion of high-end flip chip ball grid array (FCBGA) substrates ...

Taiwan IC backend service firms have seen increasing flip-chip packaging orders from China chipmaker HiSilicon now actively carrying out volume production of pre-5G chip products, leading to tight ...

Samsung Electro-Mechanics pledged to ramp up the portion of sales of its premium chip package substrate known as Flip Chip Ball Grid Array (FCBGA) to 50 percent by 2026 in order to capitalize on the ...

Samsung Electro-Mechanics announced plans to expand the proportion of high-value-added flip chip ball grid array (FCBGA) products, including servers, artificial intelligence (AI), automotive ...

Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from 5G applications in ...

Samsung Electro-Mechanics and LG Innotek, the two major IT component makers here, are trying to expand their presence in the market with a next-generation semiconductor packaging substrate called flip ...

Korean companies will show the newest semiconductor packaging technology at an annual trade show on Wednesday, as techniques grow more important in improving the performance of high-end chips. Samsung ...

Lidless FCBGA packages maximize PCB real estate by allowing closer spacing between passive components and the flip chip die. Lidless FCBGA packages enable the die to contact with an external heat sink ...